Apparatus and method for depositing low K dielectric materials
US6176198A · kind A · utility
265Cited by
4References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 2, 1998 |
| Grant date | Jan 23, 2001 |
| Priority date | — |
| Expiry date | Nov 2, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32192
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention provides a deposition system and methods of depositing materials onto substrates. In one aspect, a modular processing chamber is provided which includes a chamber body defining a processing region. The chamber body includes a removable gas feedthrough, an electrical feedthrough, a gas distribution assembly mounted on a chamber lid and a microwave applicator for generating reactive gases remote from the processing region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.