Backside gas delivery system for a semiconductor wafer processing system
US6179921A · kind A · utility
20Cited by
2References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 19, 1999 |
| Grant date | Jan 30, 2001 |
| Priority date | — |
| Expiry date | Apr 19, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T137/86895
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for a wafer processing system comprising a wafer support chuck attached to a gas delivery system for delivery of a gas to the backside of a wafer supported by the chuck. The gas delivery system has a gas shutoff valve directly connected to the wafer chuck. The shutoff valve provides a positive shutoff with negligible leak rate. By placing the valve in close proximity to the wafer chuck, the volume of the backside gas trapped between the valve and the wafer is minimized. Release of this trapped gas into the process chamber during wafer transfer has no adverse impact on the performance of the processing system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.