Thermally enhanced BGA package
US6191360A · kind A · utility
61Cited by
6References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 26, 1999 |
| Grant date | Feb 20, 2001 |
| Priority date | — |
| Expiry date | Apr 26, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A BGA package includes a substrate, a chip, and a heat spreader. The spreader covers the chip, a bottom part of the spreader is mounted on an upper surface of the substrate by an adhesive. The spreader shields Electro Magnetic Interference to the chip. In addition, the substrate is made of a built-up PCB.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.