Resist composition and process of forming a patterned resist layer on a substrate

US6210856A · kind A · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Qinghuang Lin · Yorktown Heights, US
• Timothy Hughes · Erlangen, DE
• George M. Jordhamo · Wappingers Falls, US
• Ahmad D. Katnani · Poughkeepsie, US
• Wayne M. Moreau · Wappingers Falls, US
• Niranjan M. Patel · Wappingers Falls, US

Key dates

• Filing date: Jan 27, 1999
• Grant date: Apr 3, 2001
• Expiry date: Jan 27, 2019

Classification

• Technology area (CPC G): Physics
• CPC primary: G03F7/0045
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

A radiation sensitive resist composition exhibiting high resolution and enhanced etch resistance comprising a silicon containing polymeric additive, a non-silicon containing base polymer, a photoacid generator and a base is provided. A method of forming a patterned resist film is also provided. A resist film having an upper surface region enriched with silicon is also disclosed.