Coating of vacuum chambers to reduce pump down time and base pressure
US6217715A · kind A · utility
18Cited by
6References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 6, 1997 |
| Grant date | Apr 17, 2001 |
| Priority date | — |
| Expiry date | Feb 6, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3411
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Internal surfaces of a vacuum chamber are coated with a metal or metal oxide to reduce pump down time and base pressure. The metal is sputter deposited within a partially assembled chamber from a target which comprises the metal. The chamber is then configured to process a substrate such as a silicon wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.