Cathode assembly containing an electrostatic chuck for retaining a wafer in a semiconductor wafer processing system
US6219219A · kind A · utility
32Cited by
19References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 1998 |
| Grant date | Apr 17, 2001 |
| Priority date | — |
| Expiry date | Sep 30, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6831
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cathode assembly having a pedestal and a detachable susceptor. Various contact assemblies containing a canted spring are utilized to make electrical connection between the pedestal and detachable susceptor. The canted spring has coils that are tilted in one direction and joined end to end to form a doughnut shape. Such a spring creates multiple parallel self-loading electrical connections via the turns of the spring. The turns act like electrical wires to ensure reliable RF electrical energy transfer. The canted spring contact of the present invention allows for flat contact between the pedestal and the chuck.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.