Method for assembling a chip carrier to a semiconductor device
US6220499A · kind A · utility
19Cited by
15References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 29, 1998 |
| Grant date | Apr 24, 2001 |
| Priority date | — |
| Expiry date | Sep 29, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device having C-4 solder connections is joined to a chip carrier having pads suitable for receiving the C-4 solder connections. Sacrificial solder is formed on the chip carrier pads and then planarized to result in a good, planar surface profile for joining to the semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.