Thermally conductive conformal media
US6220607A · kind A · utility
18Cited by
17References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 17, 1998 |
| Grant date | Apr 24, 2001 |
| Priority date | — |
| Expiry date | Apr 17, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S277/933
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermally conductive medium includes a body with a first melting point and phase-changing material encapsulating a portion of the body, with the phase-changing material having a second melting point. The first melting point is greater than the second melting point, and the phase-changing material is configured to be in a liquid phase at temperatures above the second melting point and a solid phase at temperatures below the same. In the liquid phase, an adhesive force is present between the body and the phase-changing material due to capillary attraction, and the phase-changing material may be wettable to one of the two surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.