Physical vapor deposition system having reduced thickness backing plate
US6221217A · kind A · utility
31Cited by
28References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 3, 1998 |
| Grant date | Apr 24, 2001 |
| Priority date | — |
| Expiry date | Dec 3, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3497
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A magnetron sputtering system is provided that uses cooling channels in the magnetron assembly to cool the target. The magnetron sputtering system also generates low pressure region in the magnetron assembly such that the backing plate sees a pressure differential much lower than atmospheric pressure. In one embodiment, the backing plate includes a center post to support the backing plate during operation. The backing plate is reduced in thickness and provides less of a barrier to the generated magnetic field.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.