Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board
US6224936A · kind A · utility
27Cited by
29References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 7, 1998 |
| Grant date | May 1, 2001 |
| Priority date | — |
| Expiry date | Oct 7, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for preventing board warpage during the application and curing or drying of liquid epoxies, or the like, on printed circuit boards using a clamping fixture assembly, which includes at least one clamping fixture support and at least one clamping fixture overlay. If desired, a plurality of printed circuit boards may be processed using an appropriate clamping fixture assembly. Furthermore, the clamping fixture may be constructed so a slight bow or curvature thereof can counter either a convex or concave bow or curvature of the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.