Plasma process apparatus for integrated circuit fabrication having dome-shaped induction coil
US6225744A · kind A · utility
8Cited by
18References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 24, 1997 |
| Grant date | May 1, 2001 |
| Priority date | — |
| Expiry date | Feb 24, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/321
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An induction plasma source for integrated circuit fabrication includes an induction coil which defines a generally convex surface. The convex surface may be in the form of a spherical section less than a hemisphere, a paraboloid, or some other smooth convex surface. The windings of the induction coil may be spaced at different intervals in different sections of the coil and may be in multiple layers in at least a portion of the coil. Varying the shape of the coil and the distribution of the coil windings allows the plasma to be shaped in a desired manner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.