Patent · US Revoked

Apparatus and methods for handling a substrate

US6227585A · kind A · utility

0Cited by
16References
36Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 4, 1998
Grant dateMay 8, 2001
Priority date
Expiry dateDec 4, 2018

Classification

  • Technology area (CPC —)General

Abstract

Substrate handling apparatus and methods are described. In one aspect, the substrate handling apparatus includes a clamping member having an extended condition wherein substrate movement relative to the transfer arm is substantially restricted and a retracted condition wherein substrate movement relative to the transfer arm is substantially free. The substrate handling apparatus further includes a sense mechanism (e.g., a vacuum sensor) constructed to determine whether a substrate is properly positioned on the support arm and to trigger the mode of operation of the clamping member between extended and retracted conditions. The sense mechanism also provides information relating to the operating condition of the clamping member.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.