Method of forming a multilayer ceramic substrate with max-punched vias
US6231707A · kind A · utility
2Cited by
8References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 22, 1998 |
| Grant date | May 15, 2001 |
| Priority date | — |
| Expiry date | Sep 22, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1056
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In the formation of multilayer ceramic substrates, greensheets are utilized which have the same pattern and number of vias punched in each greensheet. Then, selected vias may be filled with metallic paste to form the internal connections of the multilayer ceramic substrate. The remaining vias may be filled with a fugitive material or left totally unfilled. Also disclosed is the multilayer ceramic substrate produced by this method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.