Dinesh Gupta
26Patents
6h-index
62Co-inventors
72Inventor score
Filing activity: Dec 30, 1993 → Dec 28, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5480503A | Process for producing circuitized layers and multilayer ceramic sub-laminates and composites thereof | Emerging Cross-Sectional Technologies | 89 | Expired |
| US5629216A | Method for producing semiconductor wafers with low light scattering anomalies | Emerging Cross-Sectional Technologies | 42 | Expired |
| US5601672A | Method for making ceramic substrates from thin and thick ceramic greensheets | Emerging Cross-Sectional Technologies | 21 | Expired |
| US10553522B1 | Semiconductor microcooler | Electricity | 12 | Active |
| US6341417B1 | Pre-patterned substrate layers for being personalized as needed | Emerging Cross-Sectional Technologies | 9 | Expired |
| US6713686B2 | Apparatus and method for repairing electronic packages | Emerging Cross-Sectional Technologies | 9 | Expired |
| US5655209A | Multilayer ceramic substrates having internal capacitor, and process for producing same | Emerging Cross-Sectional Technologies | 5 | Expired |
| US6005228A | Electrical heating systems | Physics | 5 | Expired |
| US6245185A | Method of making a multilayer ceramic product with thin layers | Emerging Cross-Sectional Technologies | 4 | Expired |
| US10580738B2 | Direct bonded heterogeneous integration packaging structures | Electricity | 4 | Active |
| US10553516B1 | Semiconductor microcooler | Electricity | 4 | Active |
| US6475555B2 | Process for screening features on an electronic substrate with a low viscosity paste | Electricity | 3 | Expired |
| US6231707A | Method of forming a multilayer ceramic substrate with max-punched vias | Emerging Cross-Sectional Technologies | 2 | Expired |
| US10943883B1 | Planar wafer level fan-out of multi-chip modules having different size chips | Electricity | 2 | Active |
| US10490481B1 | Copper microcooler structure and fabrication | Electricity | 1 | Active |
| US10937764B2 | Three-dimensional microelectronic package with embedded cooling channels | Electricity | 1 | Active |
| US6631675B2 | Screening method for double pass screening | Electricity | 1 | Expired |
| US11049844B2 | Semiconductor wafer having trenches with varied dimensions for multi-chip modules | Electricity | 1 | Active |
| US11177217B2 | Direct bonded heterogeneous integration packaging structures | Electricity | 0 | Active |
| US11462512B2 | Three-dimensional microelectronic package with embedded cooling channels | Electricity | 0 | Active |
| US6836015B2 | Optical assemblies for transmitting and manipulating optical beams | Electricity | 0 | Expired |
| US10490480B1 | Copper microcooler structure and fabrication | Electricity | 0 | Active |
| US8089133B2 | Optical assemblies for transmitting and manipulating optical beams | Electricity | 0 | Active |
| US6662718B2 | Screening mask having a stress-relieving area | Performing Operations; Transporting | 0 | Expired |
| US11056418B2 | Semiconductor microcooler | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.