Coating for parts used in semiconductor processing chambers
US6235120A · kind A · utility
4Cited by
8References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 26, 1998 |
| Grant date | May 22, 2001 |
| Priority date | — |
| Expiry date | Jun 26, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S156/914
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Improved semiconductor processing chamber parts are provided. An improved part is made of an underlying part having both an intermediate coating and a surface layer applied thereto. The intermediate coating includes a plurality of layers each having a CTE intermediate the CTE of the underlying part and the CTE of the surface layer. The intermediate coating reduces the stress between any two layers, allowing use of underlying parts and surface layers having dissimilar CTEs. The universe of acceptable materials for use within a semiconductor processing chamber is expanded, as fewer selection criteria exist for a given layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.