Wire bond monitoring system for layered packages
US6247629A · kind A · utility
83Cited by
12References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 5, 1999 |
| Grant date | Jun 19, 2001 |
| Priority date | — |
| Expiry date | Feb 5, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wire bond monitoring system for monitoring wire bonds made on layered packages includes a technique for accessing both the die and the laminate package and making electrical contact thereto so as to test the continuity of the wire bond connection. An electrical connection can be made to a metal trace between the die and the laminate package by contacting a via extending downwardly through the package. Alternatively, a contact may be made from above using a flexible contact. The flexible contact may be attached to the wire bond clamp.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.