Method and apparatus for processing samples
US6254721A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 15, 2000 |
| Grant date | Jul 3, 2001 |
| Priority date | — |
| Expiry date | Feb 15, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67751
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is apparatus for treating samples, and a method of using the apparatus. The apparatus includes processing apparatus (a) for treating the samples (e.g., plasma etching apparatus), (b) for removing residual corrosive compounds formed by the sample treatment, (c) for wet-processing of the samples and (d) for dry-processing the samples. A plurality of wet-processing treatments of a sample can be performed. The wet-processing apparatus can include a plurality of wet-processing stations. The samples can either be passed in series through the plurality of wet-processing stations, or can be passed in parallel through the wet-processing stations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.