Alkyldione peroxides as cleaning solutions for wafer fabs
US6255266A · kind A · utility
6Cited by
6References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 11, 2000 |
| Grant date | Jul 3, 2001 |
| Priority date | — |
| Expiry date | Sep 11, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A method of cleaning elemental copper, cobalt, or nickel from the surface of equipment hardware without corroding or damaging the equipment parts and surfaces in the event of wafer breakage and non-wafer breakage is described. A solution comprising an alkyldione peroxide, a stabilizing agent, and alcohols is used to oxidize the metal and form soluble complexes which are removed by the cleaning solution. Also, a novel alkyldione peroxide solution for cleaning elemental copper, cobalt, or nickel from the surface of equipment hardware in the event of wafer breakage and non-wafer breakage is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.