Paul Ho
33Patents
10h-index
32Co-inventors
75Inventor score
Filing activity: Mar 26, 1998 → Feb 13, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6184138A | Method to create a controllable and reproducible dual copper damascene structure | Electricity | 74 | Expired |
| US6274499A | Method to avoid copper contamination during copper etching and CMP | Electricity | 48 | Expired |
| US6225221A | Method to deposit a copper seed layer for dual damascene interconnects | Electricity | 33 | Expired |
| US6251786A | Method to create a copper dual damascene structure with less dishing and erosion | Electricity | 32 | Expired |
| US6683002B1 | Method to create a copper diffusion deterrent interface | Electricity | 29 | Expired |
| US6720204B2 | Method of using hydrogen plasma to pre-clean copper surfaces during Cu/Cu or Cu/metal bonding | Electricity | 23 | Expired |
| US6017826A | Chlorine containing plasma etch method with enhanced sidewall passivation and attenuated microloading effect | Electricity | 23 | Expired |
| US6340608B1 | Method of fabricating copper metal bumps for flip-chip or chip-on-board IC bonding on terminating copper pads | Electricity | 14 | Expired |
| US6475810B1 | Method of manufacturing embedded organic stop layer for dual damascene patterning | Electricity | 13 | Expired |
| US6394114B1 | Method for stripping copper in damascene interconnects | Emerging Cross-Sectional Technologies | 13 | Expired |
| US6429117B1 | Method to create copper traps by modifying treatment on the dielectrics surface | Emerging Cross-Sectional Technologies | 8 | Expired |
| US6261954A | Method to deposit a copper layer | Electricity | 6 | Expired |
| US6255266A | Alkyldione peroxides as cleaning solutions for wafer fabs | Emerging Cross-Sectional Technologies | 6 | Expired |
| US6350689B1 | Method to remove copper contamination by using downstream oxygen and chelating agent plasma | Emerging Cross-Sectional Technologies | 6 | Expired |
| US6365508B1 | Process without post-etch cleaning-converting polymer and by-products into an inert layer | Electricity | 5 | Expired |
| US6132521A | Cleaning metal surfaces with alkyldione peroxides | Emerging Cross-Sectional Technologies | 4 | Expired |
| US6987321B2 | Copper diffusion deterrent interface | Electricity | 4 | Expired |
| US6309982A | Method for minimizing copper diffusion by doping an inorganic dielectric layer with a reducing agent | Electricity | 4 | Expired |
| US6358821B1 | Method of copper transport prevention by a sputtered gettering layer on backside of wafer | Electricity | 3 | Expired |
| US6261955A | Application of vapor phase HFACAC-based compound for use in copper decontamination and cleaning processes | Emerging Cross-Sectional Technologies | 3 | Expired |
| US6540841B1 | Method and apparatus for removing contaminants from the perimeter of a semiconductor substrate | Performing Operations; Transporting | 3 | Expired |
| US6391783B1 | Method to thin down copper barriers in deep submicron geometries by using alkaline earth element, barrier additives, or self assembly technique | Electricity | 3 | Expired |
| US6368958B2 | Method to deposit a cooper seed layer for dual damascence interconnects | Electricity | 2 | Expired |
| US10290432B1 | Method for forming perovskite solar cell with printable carbon electrode | Emerging Cross-Sectional Technologies | 2 | Active |
| US6813796B2 | Apparatus and methods to clean copper contamination on wafer edge | Performing Operations; Transporting | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.