Damascene T-gate using a relacs flow
US6270929A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 20, 2000 |
| Grant date | Aug 7, 2001 |
| Priority date | — |
| Expiry date | Jul 20, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/518
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for fabricating a T-gate structure is provided. A structure is provided that has a silicon layer having a gate oxide layer, a polysilicon layer over the gate oxide layer and an insulating layer over the gate oxide layer. A photoresist layer is formed over the insulating layer. An opening is the formed extending through the photoresist layer and partially into the insulating layer. The opening in the insulating layer extends from a top surface of the insulating layer to a first depth. The photoresist layer is swelled to reduce the size of the opening in the photoresist layer. The opening is then extended in the insulating layer from the first depth to a second depth. The opening is wider from the top surface of the insulating layer to the first depth than the opening is from the first depth to the second depth. The opening is then filled with a conductive material to form a T-gate structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.