Method for enhancing fatigue life of ball grid arrays
US6283359A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 23, 2000 |
| Grant date | Sep 4, 2001 |
| Priority date | — |
| Expiry date | Aug 23, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2991
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This invention relates to a solder structure which provides enhanced fatigue life properties when used to bond substrates particularly at the second level such as BGA and CGA interconnections. The solder structure is preferably a sphere or column and has a metal layer wettable by solder and the structure is used to make solder connections in electronic components such as joining an electronic module such as a chip connected to a MLC which module is connected to a circuit board. The solder structure preferably has an overcoat of solder on the metal layer to provide a passivation coating to the metal layer to keep it clean from oxidation and corrosion and also provide a wettable surface for attachment of the solder structure to solder on the pads of the substrate being bonded.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.