System and method for etching organic anti-reflective coating from a substrate
US6296780A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 8, 1997 |
| Grant date | Oct 2, 2001 |
| Priority date | — |
| Expiry date | Dec 8, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31116
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention is embodied in a method and apparatus for etching an organic anti-reflective coating (OARC) layer and a titanium nitride anti-reflective coating (TiN ARC) layer deposited on a substrate located within a processing chamber, without the need for removing the substrate being processed from the processing chamber in which it is situated and without the need for intervening processing steps, such as chamber cleaning operations. The substrate has a base, an underlying oxide layer above the base, an overlying layer above the underlying layer, a middle conductive layer, a TiN ARC layer, and a top OARC layer spun on top of the TiN ARC.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.