Chemical-mechanical polishing device
US6306022A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Jun 2, 2000 |
| Grant date | Oct 23, 2001 |
| Priority date | — |
| Expiry date | Jun 2, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D7/10
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A device for chemical-mechanical polishing. The device can be applied to a chemical polishing table spinning in a fixed direction and a polishing pad above of it. A chemical-mechanical polishing device according to the present invention is at least comprised of a main body of conditioner with a plurality of mounting pads, wherein each mounting pad is mounted with the diamond granules and located on the lower surface of conditioner, distributed on the rim of main body of each mounting pad. It can contact with polishing pads when cleaning the polishing pads and a number of cavities are across the upper and lower surfaces of each main body of conditioner and distributed between each mounting pads as well. When using the conditioners to clean out the polishing pads, the de-ionized water will flow through the cavities to wash off the acid or basic slurry to eliminate the destruction made by the solders around the diamond granules to extend the durability of the conditioner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.