Vertical plasma enhanced process apparatus and method
US6321680A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 12, 1999 |
| Grant date | Nov 27, 2001 |
| Priority date | — |
| Expiry date | Jan 12, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67757
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A plasma enhanced chemical vapor deposition (PECVD) system having an upper chamber for performing a plasma enhanced process, and a lower chamber having an access port for loading and unloading wafers to and from a wafer boat. The system includes apparatus for moving the wafer boat from the upper chamber to the lower chamber. The wafer boat includes susceptors for suspending wafers horizontally, spaced apart in a vertical stack. An RF plate is positioned in the boat above each wafer for generating an enhanced plasma. An RF connection is provided which allows RF energy to be transmitted to the RF plates while the wafer boat is rotated. Apparatus for automatic wafer loading and unloading is provided, including apparatus for lifting each wafer from its supporting susceptor and a robotic arm for unloading and loading the wafers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.