Method for coating ultra-thin resist films
US6326319A · kind A · utility
1Cited by
4References
4Claims
0Family size
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Key dates
| Filing date | Jul 3, 2000 |
| Grant date | Dec 4, 2001 |
| Priority date | — |
| Expiry date | Jul 3, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02307
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is provided a method for applying a lower viscosity coating liquid onto a semiconductor wafer substrate so as to prevent adhesion loss and to maintain low defect level characteristics. This is achieved by priming the substrate with a bonding agent at a temperature in the range of 18.degree. C. to 50.degree. C. for a short amount of time. This is performed prior to the application of a liquid solvent. As a result, there is overcome the problems of poor adhesion to the substrates and high defect levels in the coated UTR films.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.