Temperature control system for process chamber

US6326597A · kind A · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Dmitry Lubomirsky · Cupertino, US
• Allen D'Ambra · Millbrae, US
• Edward Floyd · Santa Clara, US
• Qiwei Liang · Fremont, US
• Daniel J. Hoffman · Saratoga, US
• Victor H. Fuentes · Sunnyvale, US
• Simon Yavelberg · Cupertino, US
• Jerry Chen · Arlington, US

Key dates

• Filing date: Apr 15, 1999
• Grant date: Dec 4, 2001
• Expiry date: Apr 15, 2019

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/67248
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Temperature control of a process chamber 25 is achieved by directing a flow of gas at an external surface 100 of the chamber 25. In one aspect, gas directed at the chamber 25 passes through a gas flow amplifier 115 that increases the gas flow. Gas for the temperature control can be drawn in from the ambient air and, after passing over the process chamber 25, the gas can flow out through an outlet 150. Data is presented demonstrating superior temperature control performance over a conventional system.