Barrier layer for electroplating processes
US6328871A · kind A · utility
110Cited by
9References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 16, 1999 |
| Grant date | Dec 11, 2001 |
| Priority date | — |
| Expiry date | Aug 16, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76877
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention generally provides a method for preparing a surface for electrochemical deposition comprising forming a high conductance barrier layer on the surface and depositing a seed layer over the high conductance barrier layer. Another aspect of the invention provides a method for filling a structure on a substrate, comprising depositing a high conductance barrier layer on one or more surfaces of the structure, depositing a seed layer over the barrier layer, and electrochemically depositing a metal to fill the structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.