Method and apparatus for reliability testing of integrated circuit structures and devices
US6329831A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 8, 1997 |
| Grant date | Dec 11, 2001 |
| Priority date | — |
| Expiry date | Aug 8, 2017 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2874
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and apparatus for monitoring and controlling integrated circuit devices-under-test (DUTS). A preferred embodiment includes a computer based controller, a temperature control module, a power supply controller, a chamber interface module, a driver card and a DUT board. The computer-based controller responding to preprogrammed instructions (software) operates and coordinates the temperature control module, the chamber interface module, the power supply controller, and the driver card. The driver card, receiving commands and data from the computer-based controller, sends and receives a number of signals to and from the DUTs on the DUT board. These signals include voltage sources for operating the DUTs, a load voltage, DC current sources for setting duty and frequency cycles, switch signals, voltage measurement signals, and resistance measurement signals. The DUT board is a printed circuit board for holding a number of DUTs. Each of the DUTs is an integrated circuit containing one or more sets of circuitry for testing specifically designed test structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.