Thin film capacitor coupons for memory modules and multi-chip modules
US6342724B1 · kind B1 · utility
59Cited by
64References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2000 |
| Grant date | Jan 29, 2002 |
| Priority date | — |
| Expiry date | Sep 25, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S257/924
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device including a thin capacitor coupon mounted to the backside of a semiconductor die. When mounted active surface up on a carrier substrate of a multi-chip module, the coupon is secured between the backside of the die and the substrate. When flip-chip connections or direct chip attach are employed between the die and substrate, the coupon is secured to the backside of the die. The coupons may be preformed, or formed on the die in a wafer-scale fabrication process prior to singulation of the dice.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.