Wafer boat and film formation method
US6344387B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 11, 2000 |
| Grant date | Feb 5, 2002 |
| Priority date | — |
| Expiry date | May 11, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67309
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer boat that supports a plurality of semiconductor wafers at a predetermined pitch, which are to be processed by a vertical thermal processing furnace, comprises a plurality of support columns; wafer support grooves formed in the support columns for supporting the peripheral edges of the wafers; and a film thickness equalization plate that is substantially the same size as the wafers, or is larger than the wafers, and is provided in wafer support grooves that are adjacent to one another in the vertical direction. This configuration ensures the same type of film is formed on the surface facing the surface of the wafer, achieving uniformity of the thus-formed film thickness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.