Apparatus and method for conditioning a fixed abrasive polishing pad in a chemical mechanical planarization process
US6361414B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2000 |
| Grant date | Mar 26, 2002 |
| Priority date | — |
| Expiry date | Jun 30, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B53/10
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for conditioning a fixed abrasive polishing pad used in chemical mechanical planarization of semiconductor wafers is described. The apparatus includes a conditioning member formed from glass, at least one collimated hole structure located within the conditioning member, wherein the collimated hole structure forms a channel, and wherein each channel is arranged in a generally parallel orientation with respect to any other channel. The method includes providing at least one conditioning member formed with at least one capillary tube array, wherein the capillary tube array forms multiple channels within the conditioning member, pressing the conditioning member against the fixed abrasive polishing pad, and moving the fixed abrasive polishing pad. In one embodiment, the method further comprises rotating the conditioning member to simulate the polishing of at least one semiconductor wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.