Method of chemical mechanical polishing with edge control
US6361420B1 · kind B1 · utility
32Cited by
18References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 8, 2000 |
| Grant date | Mar 26, 2002 |
| Priority date | — |
| Expiry date | Feb 8, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/30
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A carrier head, particularly suited for chemical mechanical polishing of a flatted substrate, includes a flexible membrane and an edge load ring. A lower surface of the flexible membrane provides a receiving surface for a center portion of the substrate, whereas a lower surface of the edge load ring provides a receiving surface for a perimeter portion of the substrate. A slurry suitable for chemical mechanical polishing a flatted substrate includes water, a colloidal silica that tends to agglomerate, and a fumed silica that tends not to agglomerate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.