Multi-part lead frame with dissimilar materials and method of manufacturing
US6362022B1 · kind B1 · utility
10Cited by
9References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 30, 2000 |
| Grant date | Mar 26, 2002 |
| Priority date | — |
| Expiry date | Oct 30, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multi-part lead frame die assembly is disclosed including a die bonded to a die paddle. A second lead frame including leads is superimposed and bonded onto the first lead frame. Also disclosed is a method for fabricating the multi-part lead frame assembly which utilizes equipment designed for single lead frame processing. If desired, the materials for the multi-part lead frame may be dissimilar.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.