Support assembly with thermal expansion compensation
US6364957B1 · kind B1 · utility
286Cited by
18References
55Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 8, 2000 |
| Grant date | Apr 2, 2002 |
| Priority date | — |
| Expiry date | Feb 8, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/2001
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A substrate support assembly 30 comprises a substrate support 38 and a collar 130 which may comprise at least one slit 150. The slit allows for thermal expansion compensation in the support assembly 30. The collar 130 may, for example, protect the dielectric 45 from erosion in a process chamber 25. In one version, the collar 130 comprises a clamping ring 200 on the dielectric 45.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.