Bryan Pu
42Patents
21h-index
86Co-inventors
88Inventor score
Filing activity: Apr 28, 1995 → Dec 20, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8231799B2 | Plasma reactor apparatus with multiple gas injection zones having time-changing separate configurable gas compositions for each zone | Electricity | 532 | Expired |
| US6403491B1 | Etch method using a dielectric etch chamber with expanded process window | Electricity | 292 | Expired |
| US6364957B1 | Support assembly with thermal expansion compensation | Electricity | 286 | Expired |
| US5843847A | Method for etching dielectric layers with high selectivity and low microloading | Electricity | 270 | Expired |
| US7316761B2 | Apparatus for uniformly etching a dielectric layer | Electricity | 162 | Expired |
| US6916399B1 | Temperature controlled window with a fluid supply system | Electricity | 138 | Expired |
| US6326307A | Plasma pretreatment of photoresist in an oxide etch process | Electricity | 125 | Expired |
| US5674321A | Method and apparatus for producing plasma uniformity in a magnetic field-enhanced plasma reactor | Electricity | 119 | Expired |
| US5891350A | Adjusting DC bias voltage in plasma chambers | Electricity | 96 | Expired |
| US6113731A | Magnetically-enhanced plasma chamber with non-uniform magnetic field | Electricity | 75 | Expired |
| US5740009A | Apparatus for improving wafer and chuck edge protection | Electricity | 73 | Expired |
| US6273022A | Distributed inductively-coupled plasma source | Electricity | 62 | Expired |
| US6568346B2 | Distributed inductively-coupled plasma source and circuit for coupling induction coils to RF power supply | Electricity | 54 | Expired |
| US6451703B1 | Magnetically enhanced plasma etch process using a heavy fluorocarbon etching gas | Electricity | 53 | Expired |
| US6284093A | Shield or ring surrounding semiconductor workpiece in plasma chamber | Emerging Cross-Sectional Technologies | 51 | Expired |
| US6716302B2 | Dielectric etch chamber with expanded process window | Electricity | 48 | Expired |
| US6829056B1 | Monitoring dimensions of features at different locations in the processing of substrates | Electricity | 48 | Expired |
| US6825618B2 | Distributed inductively-coupled plasma source and circuit for coupling induction coils to RF power supply | Electricity | 46 | Expired |
| US6022446A | Shallow magnetic fields for generating circulating electrons to enhance plasma processing | Electricity | 42 | Expired |
| US6797639B2 | Dielectric etch chamber with expanded process window | Electricity | 36 | Expired |
| US8609546B2 | Pulsed bias plasma process to control microloading | Electricity | 22 | Active |
| US6689249B2 | Shield or ring surrounding semiconductor workpiece in plasma chamber | Emerging Cross-Sectional Technologies | 21 | Expired |
| US6613689B2 | Magnetically enhanced plasma oxide etch using hexafluorobutadiene | Electricity | 18 | Expired |
| US6221782A | Adjusting DC bias voltage in plasma chamber | Electricity | 17 | Expired |
| US8187415B2 | Plasma etch reactor with distribution of etch gases across a wafer surface and a polymer oxidizing gas in an independently fed center gas zone | Electricity | 15 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.