Carrier head with local pressure control for a chemical mechanical polishing apparatus
US6368191B1 · kind B1 · utility
5Cited by
25References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2000 |
| Grant date | Apr 9, 2002 |
| Priority date | — |
| Expiry date | Sep 20, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/16
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane, the lower surface of which provides a substrate-receiving surface. The carrier head may include a projection which contacts an upper surface of the flexible membrane to apply an increased load to a potentially underpolished region of a substrate. Fluid jets may be used for the same purpose.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.