Patent · US Expired

Boat for land grid array packages

US6371310B1 · kind B1 · utility

4Cited by

8References

16Claims

0Family size

Assignee

Advanced Micro Devices, Inc. · US

Inventors

Raj N. Master · San Jose, US
Mohammad Khan · San Jose, US
L. K. Teoh · Bukit Mertajam, MY

Key dates

Filing date	Dec 21, 2000
Grant date	Apr 16, 2002
Priority date	—
Expiry date	Dec 21, 2020

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/67333
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A boat is formed with layers comprising substantially aligned holes for safely accommodating land grid array semiconductor packages during assembly. The boat includes a bottom layer with an array of through-holes having a substantially square cross-sectional shape with rounded corners, a middle layer with an array of through-holes having a substantially octagonal cross-sectional shape and a top layer having an array of through-holes having a substantially square cross-sectional shape with notched sides and vertical tabs extending upwardly from the sidewalls of each notched side. The layers may be attached by spot welding or other means.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.