Groove cleaning device for chemical-mechanical polishing
US6371836B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2000 |
| Grant date | Apr 16, 2002 |
| Priority date | — |
| Expiry date | Sep 20, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/26
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An improved chemical-mechanical polishing method and apparatus is provided. A brush is employed to continually brush slurry particles from surface features, e.g., grooves, on a polishing pad. In this manner slurry is prevented from becoming compacted within the grooves as the slurry passes beneath and is subjected to compressive forces of a wafer polishing head. The invention may be practiced by use of a stationary brush operatively coupled to the polishing pad surface, or by an improved conditioning assembly having both a diamond surface for conditioning the polishing pad and a brush for cleaning the pad's surface features. The brush portion of the conditioning assembly may or may not rotate as it is scanned across the surface of the polishing pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.