Analysis of CD-SEM signal to detect scummed/closed contact holes and lines
US6373053B1 · kind B1 · utility
7Cited by
9References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2000 |
| Grant date | Apr 16, 2002 |
| Priority date | — |
| Expiry date | Jan 31, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A system is provided for detecting scumming in a wafer. The system includes an analysis system for providing a signal corresponding to a surface portion of the wafer and a processing system operatively coupled to the analysis system. The processing system is configured to determine a shape of at least a portion of the signal and, the processing system detects scumming in the wafer based upon the shape of at least a portion of the signal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.