Surface metallization structure for multiple chip test and burn-in
US6376054B1 · kind B1 · utility
2Cited by
30References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 10, 1999 |
| Grant date | Apr 23, 2002 |
| Priority date | — |
| Expiry date | Feb 10, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24926
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A cost-effective surface metallization structure of a TCA carrier is produced by using a high-grit conducting paste to fill TSM vias in the TSM of the TCA carrier. This concept can be applied to alumina substrates with refractory metal conductors or to LCGC substrates with more noble metal conductors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.