Enhanced cooling IMP coil support
US6376807B1 · kind B1 · utility
11Cited by
6References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 9, 1999 |
| Grant date | Apr 23, 2002 |
| Priority date | — |
| Expiry date | Jul 9, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67103
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention generally provides a substrate processing system having a thermally conductive and electrically insulative member coupled to a heated member that provides for heat dissipation from the heated member. In a preferred embodiment, the present invention provides for heat dissipation through thermal conductance of an electrically insulated coil in an IMP reaction chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.