Apparatus and methods for chemical mechanical polishing with an advanceable polishing sheet
US6379231B1 · kind B1 · utility
20Cited by
32References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2000 |
| Grant date | Apr 30, 2002 |
| Priority date | — |
| Expiry date | Jun 20, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/30625
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A chemical mechanical polishing apparatus has a rotatable platen, a generally linear polishing sheet having an exposed portion extending over a top surface of the platen for polishing the substrate, and a drive mechanism to incrementally advance the polishing sheet in a linear direction across a top surface of the platen. The polishing sheet is releasably secured to the platen to rotate with the platen, and it has a width greater than a diameter of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.