Patent · US Expired

Dielectric filling of electrical wiring planes

US6380076B2 · kind B2 · utility

1Cited by

7References

15Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Markus Kirchhoff · Radeberg, DE
Michael Rogalli · Rottenburg am Neckar, DE
Stephan Wege · Osterburken, DE

Key dates

Filing date	Dec 18, 2000
Grant date	Apr 30, 2002
Priority date	—
Expiry date	Dec 18, 2020

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The present invention relates to a dielectric filling for electrical wiring planes of an integrated circuit. The electrical wiring of the integrated circuit comprises a base body on which track and passivation planes can already be disposed; a conductive layer which is disposed on the base body and is patterned in such a manner that it exhibits a first conductor track, a second conductor track and a trench between the first conductor track and the second conductor track; at least one dielectric layer is disposed on the conductive layer and at least partially fills the trench, the preferred material of the dielectric layer being the polymer material polybenzoxazole.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.