Process of drying semiconductor wafers using liquid or supercritical carbon dioxide
US6398875B1 · kind B1 · utility
23Cited by
27References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2001 |
| Grant date | Jun 4, 2002 |
| Priority date | — |
| Expiry date | Jun 27, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process of drying a semiconductor wafer which includes at least one microelectric structure disposed thereon which includes contacting a water-containing thin film-covered semiconductor wafer with a composition which includes liquid or supercritical carbon dioxide and a surfactant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.