Method and system of cleaning a wafer after chemical mechanical polishing or plasma processing
US6405399B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 25, 1999 |
| Grant date | Jun 18, 2002 |
| Priority date | — |
| Expiry date | Jun 25, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and system are provided for cleaning a surface of a semiconductor wafer following a fabrication operation. The system includes a brush box, which has a fluid manifold and at least one nozzle. The nozzle is connected to the fluid manifold by a flexible conduit. The nozzle is configured to spray a liquid onto the surface of the wafer at an application angle and at a fan angle. The application angle is defined between a plane of the surface of the wafer and a spraying plane of the liquid. The fan angle and the application angle are configured such that the spraying liquid covers the surface of the wafer in a quiescent manner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.