Apparatus for transferring semiconductor substrates using an input module
US6406359B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 31, 2000 |
| Grant date | Jun 18, 2002 |
| Priority date | — |
| Expiry date | May 31, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68707
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system for polishing a semiconductor substrate. Specifically, the system includes one or more polishing modules and a cleaning module. A rail is disposed between the polishing modules and the cleaning module. The rail has a first end disposed proximate a transfer station disposed on the polishing module and a second end disposed proximate the cleaning module. A robot is movably disposed on the rail. The robot is adapted to transfer a substrate between the transfer station and the cleaning module. Additional embodiments of the invention include having the cleaning module in an orientation perpendicular to an orientation of the rail and having the cleaning module in an orientation perpendicular to an orientation of the rail.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.