Horizontal sputtering system
US6413381B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 12, 2000 |
| Grant date | Jul 2, 2002 |
| Priority date | — |
| Expiry date | Apr 12, 2020 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/566
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A plasma sputtering system that may be used to deposit a film on a substrate such as an optical disk is disclosed. In one embodiment, the sputtering system includes a main vacuum chamber. A plurality of sputtering chambers and a load lock chamber are connected to the main vacuum chamber. An assembly of a horizontal unprocessed substrate, an inner mask, and an outer mask are pressed onto a substrate transport tray that is positioned in the load lock. The tray supports the substrate and the masks throughout the processing of the substrate. A vertical lift lowers the tray from the load lock onto a carousel. The carousel transports the tray, substrate and masks to the sputtering chambers and then back to the load lock for unloading. Other lifts raise the tray, processed substrate, and masks from the carousel to the sputtering chambers. The tray is selectively pressed against the lower access aperture of the load lock and sputtering chambers so as to isolated them from the main chamber. After processing is complete, the lift pedestal at the load lock raises the tray and the substrate and masks thereon from the carousel to the load lock, whereupon the substrate and masks are removed from…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.