System for chemical mechanical planarization
US6413873B1 · kind B1 · utility
50Cited by
4References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 3, 2000 |
| Grant date | Jul 2, 2002 |
| Priority date | — |
| Expiry date | May 3, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/30625
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A semiconductor substrate processing system for polishing a substrate that generally includes a platen and a web of polishing material disposed thereon. Embodiments of the system include a disposable cartridge for housing the web of polishing material, a shield member disposed proximate the web for preventing contamination of the unused portion of the web, a fluid delivery for fixing and freeing the web from the platen, apparatus for controlling the lateral movement of the web, and an apparatus for providing more linear feet of polishing material per height of a roll.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.