Alignment mark design
US6420791B1 · kind B1 · utility
55Cited by
8References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 23, 1999 |
| Grant date | Jul 16, 2002 |
| Priority date | — |
| Expiry date | Nov 23, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/975
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An alignment mark design has a metal plateau and a metal material formed over a substrate. The metal plateau is within a first dielectric layer. Openings within a second dielectric layer above the first dielectric layer are filled with a metal material. The metal material and the second dielectric layer alternate so that a part of the exposure light passing through the second dielectric layer between sections of the metal material can be reflected into an alignment system by the metal plateau.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.