Process for removing chemical mechanical polishing residual slurry

US6425956B1 · kind B1 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• John M. Cotte · New Fairfield, US
• Donald J. Delehanty · Wappingers Falls, US
• Kenneth McCullough · Fishkill, US
• Wayne M. Moreau · Wappingers Falls, US
• John P. Simons · Cold Spring, US
• Charles J. Taft · Wappingers Falls, US
• Richard P. Volant · New Fairfield, US

Key dates

• Filing date: Jan 5, 2001
• Grant date: Jul 30, 2002
• Expiry date: Jan 5, 2021

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S134/902
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

A process of removing residual slurry resulting from chemical mechanical polishing of a workpiece in which the workpiece is contacted with a composition of a supercritical fluid, said supercritical fluid including supercritical, carbon dioxide and a co-solvent, and a surfactant.